Thermal Pad TFP-M series | 3.5 ~ 5.1 W/mK
Other Thermal Conductivities Selections
1 – 1.5 W/mK
2.2 – 3.2 W/mK
6-15 W/mK
Product Highlights of Thermal Pad TFP-M series (3.5 – 5.1 W/mK)
- Thermal conductivity 3.5 ~ 5.1 W/mK
- Self adhesion
- UL94 V-0 flame retardant grade
- Thickness range: 0.003 inch (0.07mm) – 0.400 inch (10.0mm)
Application Examples of of Thermal Pad TFP-M series (3.5 – 5.1 W/mK)
- Desktop computer, laptop and server
- LED lighting equipment
- Automotive electronics
- LCD and PDP flat display
- Automotive electrical modules, battery heat dissipation
The TFP series thermal pads, with thermal conductivity ranging from 3.5 to 5.1 W/m.K, offer superior thermal performance. Crafted with a special formulation, these pads ensure excellent heat transfer while remaining easy to handle. The material’s natural tackiness ensures strong adhesion to the application area, significantly reducing thermal resistance.
For added convenience during installation and rework, a non-sticky “dry surface” can be created on one side through a unique process. This non-tacky side allows for easy removal from IC chips, PCBs, or other components without causing damage. The tacky side is typically applied to heat sinks, cold plates, or housings, ensuring secure placement and effective heat dissipation.
Industry-Standard Thermal Validation of Thermal Pad TFP series L
To ensure the accuracy of our Thermal Pad 1.0-1.5w/mK ratings, we verify all TFP series materials using the ASTM D5470 standard. This ensures that the thermal impedance and conductivity data we provide are measured through the industry-recognized steady-state method, giving you total confidence in your heat dissipation calculations
SPECIFICATIONS TABLE
| Part Numbers | TFP3550 | TFP3525 | TFP3525PM | TFP4025 | TFP5045 | TFP5155 | TFP5150LV | TFP5125 | |
|---|---|---|---|---|---|---|---|---|---|
| Parametes | Unit of Measure | ||||||||
| Colour | – | Pink | Pink | Pink | Yellow | Light Green | Grey | Grey | Grey |
| Thickness | mm | 0.25~10 | 0.25~10 | 0.25~10 | 0.25~10 | 0.25~10 | 0.25~10 | 0.25~10 | 0.25~10 |
| Thermal Conductivity | W/m·K | 3.5 | 3.5 | 3.5 | 4 | 5 | 5.1 | 5.1 | 5.1 |
| Thermal Resistance @1mm，20psi | oC·in²/W | 0.39 | 0.35 | 0.45 | 0.37 | 0.27 | 0.27 | 0.27 | 0.24 |
| oC·cm²/W | 2.51 | 2.26 | 2.9 | 2.39 | 1.74 | 1.74 | 1.74 | 1.55 | |
| Hardness | Shore00 | 50 | 25 | 25 | 25 | 45 | 55 | 50 | 25 |
| Flammability Rating | V0 | V0 | V0 | V0 | V0 | V0 | V0 | V0 | |
| Breakdown Voltage | kV(@1mm) | >10 | >10 | >15 | >10.0 | >9 | >9 | >9 | >9 |
| Volume Resistivity | Ω ·cm | ≥1.0×10¹³ | ≥1.0×10¹³ | ≥1.0×10¹³ | ≥1.0×10¹³ | ≥1.0×10¹³ | ≥1.0×10¹³ | ≥1.0×10¹³ | ≥1.0×10¹³ |
| Density | g/cm³ | 3.1 | 3.1 | 3.1 | 3.1 | 3.1 | 3.1 | 3.1 | 3.1 |
| Tensile Strength | psi | 35 | 26 | 30 | 42 | 45 | 52 | 52 | 52 |
| Elongation | % | 42 | 45 | 45 | 48 | 50 | 50 | 50 | 50 |
| Compression Ratio(%, at given pressure) | 10psi | 13 | 16 | 14 | 15 | 13 | 12 | 12 | 15 |
| 50psi | 36 | 48 | 45 | 42 | 35 | 32 | 32 | 38 | |
| 100psi | 52 | 62 | 58 | 56 | 55 | 50 | 50 | 60 | |
| Dielectric Constant | @1MHz | 5.5 | 5.5 | 5.5 | 6.5 | 6 | 6.5 | 6 | 6.5 |
| Low Volatile Content (D4~D20) | ppm | – | – | – | – | – | – | – | – |
| TML(CVCM) | % | ≤0.20(0.05) | ≤0.20(0.05) | ≤0.20(0.05) | ≤0.20(0.05) | ≤0.15(0.04) | ≤0.15(0.04) | ≤0.15(0.04) | ≤0.15(0.04) |
| Oprerating Temperature | oC | -60~+200 | 60~+200 | -60~+200 | -60~+200 | -60~+200 | -60~+200 | -60~+200 | -60~+200 |
| RoHS | YES | YES | YES | YES | YES | YES | YES | YES |