TFP-series | 2.2 ~ 3.0 W/mK
Product Highlights
- Thermal conductivity 2.2 ~ 3.0 W/mK
- Self adhesive
- UL94 V-0 flame retardant grade
- Thickness range: 0.003 inch (0.07mm) -0.400 inch (10.0mm)
Application
- Desktop computer, laptop and server
- LED lighting equipment
- Automotive electronics
- LCD and PDP flat display
- Automotive electrical modules, battery heat dissipation
The TFP series thermal pads are designed to provide an efficient, cost-effective solution for heat management in electronics. Their special formulation gives them low density while ensuring excellent thermal performance, making them easy to handle during installation. The material’s natural tackiness ensures a snug fit, which helps reduce thermal resistance and improves overall heat transfer efficiency.
These pads are particularly well-suited to current packaging design trends that prioritize lightweight solutions. The low density aligns with the need for reduced weight in modern electronic devices, contributing to more efficient, compact designs.
In terms of usability, the TFP series offers enhanced convenience for installation and rework. One side of the pad features a non-sticky “dry surface” created by a unique process. This allows for easy removal from IC chips, PCBs, or other components without causing damage, making it perfect for rework situations. The tacky side of the pad is typically applied to heat sinks, cold plates, or housings for effective heat dissipation, ensuring the thermal pad remains securely in place during operation.
Overall, the GBA TFP series combines performance with ease of use and reworkability, offering an excellent balance of cost, efficiency, and convenience.
SPECIFICATIONS TABLE
| Part Numbers | TFP2250 | TFP2225 | TFP2240LV | TFP2850 | TFP2830HT | TFP3050 | TFP3035LV | TFP3045LD | TFP3025LB | |
|---|---|---|---|---|---|---|---|---|---|---|
| Parameters | Unit of Measure | |||||||||
| Colour | – | Black | Grey | Grey | Light Blue | Light Blue | Grey | Light Blue | Violet | Light Blue |
| Thickness | mm | 0.15~10 | 0.15~10 | 0.15~10 | 0.2~10 | 0.2~10 | 0.2~10 | 0.2~10 | 0.3~10 | 0.2~10 |
| Thermal Conductivity | W/m·K | 2.2 | 2.2 | 2.2 | 2.8 | 2.8 | 3.0 | 3.0 | 3.0 | 3.0 |
| Thermal Resistance @1mm，20psi | oC·in²/W | 0.75 | 0.65 | 0.7 | 0.46 | 0.42 | 0.42 | 0.42 | 0.35 | 0.42 |
| oC·cm²/W | 4.85 | 4.19 | 4.52 | 2.97 | 2.7 | 2.71 | 2.71 | 2.26 | 2.71 | |
| Hardness | Shore00 | 50 | 25 | 40 | 50 | 30 | 50 | 35 | 45 | 25 |
| Flammability Rating | V0 | V0 | V0 | V0 | V0 | V0 | V0 | V0 | V0 | |
| Breakdown Voltage | kV(@1mm) | >9.0 | >9.0 | ≥10.0 | >9.0 | >9.0 | >9 | >9.0 | >10 | >9.0 |
| Volume Resistivity | Ω ·cm | ≥3.0×1013 | ≥3.0×1013 | ≥3.0×1013 | ≥1.0×1013 | ≥1.0×1013 | ≥1.0×1013 | ≥1.0×1013 | ≥2.0×1013 | ≥1.0×1013 |
| Density | g/cm³ | 2.6 | 2.6 | 2.6 | 3 | 3 | 3 | 3 | 1.6 | 3 |
| Tensile Strength | psi | 36 | 32 | / | 60 | 50 | 52 | 35 | 40 | 50 |
| Elongation | % | 55 | 58 | / | 55 | 58 | 57 | 58 | 65 | 58 |
| Compression Ratio (%, at given pressure) | 10psi | 12 | 28 | 15 | 12 | 25 | 12 | 20 | 25 | 23 |
| 50psi | 42 | 55 | 47 | 35 | 52 | 42 | 48 | 52 | 50 | |
| 100psi | 58 | 86 | 69 | 48 | 84 | 56 | 75 | 85 | 83 | |
| Dielectric Constant | @1MHz | 7.5 | 7.5 | 7.5 | 5.5 | 5.5 | 5.5 | 5.5 | 3 | 5.5 |
| Low Volatile Content (D4~D20) | ppm | – | – | – | – | – | – | – | <80 | – |
| TML(CVCM) | % | ≤0.32(0.08) | ≤0.32(0.08) | ≤0.32(0.08) | ≤0.20(0.05) | ≤0.20(0.05) | ≤0.18(0.05) | ≤0.20(0.05) | ≤0.15(0.05) | ≤0.20(0.05) |
| Operating Temperature | oC | -60~+200 | 60~+200 | -60~+200 | -60~+200 | -60~+200 | -60~+200 | -60~+200 | -60~+200 | -60~+200 |
| RoHS | YES | YES | YES | YES | YES | YES | YES | YES | YES |