RF Absorber Hybrid Gel | SF Series
Product Highlights of RF Absorber Hybrid Gel
- Thermal conductivity 3.5~6.0 W/m·K
- Thermal/EMI hybrid function
- Especially suitable for 25 Ghz optical modules
- High reliability and weather resistance
- Fully cured, never dry
- Easy to dispense, good plasticity
Application
- Consumer electronics, telecommunication device
- Tablet, multimedia device
- Desktops, laptops and servers
- Optical fiber telecommunication device
- Consumer electronics
- Defense electronic device
The SFA series material provides excellent thermal performance, microwave absorption, low compressibility and high reliability. In addition to providing application flexibility and variable gap adaptation, the ViaTHERM™ SFA series also has excellent compressibility and conformability, making it easier to fully contact the mating parts to improve the heat transfer efficiency.
Unlike thermal grease, ViaTHERM SFA series gel has no settling and no flow over issue, suitable for dispensing, screen printing or squeegee coating.
Technical Overview & Compliance
The RF Absorber Hybrid Gel represents the pinnacle of “Value-Added Engineering” for automated manufacturing. Unlike traditional pads, this soft, pre-cured gel can be dispensed into irregular 3D geometries, ensuring 100% contact with heat-generating components while simultaneously absorbing high-frequency interference. Its low-stress formulation is specifically designed to protect sensitive solder joints and delicate flip-chip architectures from mechanical strain during thermal expansion.
To ensure long-term stability in high-reliability environments, our hybrid gels are rigorously tested for dielectric strength and thermal stability. These materials are formulated to meet the IPC-TM-650 Test Methods Manual, the industry standard for characterizing the physical and electrical properties of materials used in printed boards and assemblies. This compliance ensures that the RF Absorber Hybrid Gel maintains consistent viscosity, thermal impedance, and EMI attenuation levels throughout the entire lifecycle of the device, even under continuous high-temperature operation.
SPECIFICATIONS TABLE
| Part Numbers | SFA3500 | SFA6000 | |
|---|---|---|---|
| Parameters | Units of Measure | ||
| Colour | – | Black | Grey |
| Curing Schedule @30cc syringe 0.1″ needle nozzle, 90Psi | g/min | 20 | 25 |
| Thermal Conductivity | W/m·K | 3.50 | 6.00 |
| Thermal Resistance @20psi | ℃·in²/W | 0.07 | 0.032 |
| ℃·cm²/W | 0.45 | 0.206 | |
| Minimum Thickness | mm | 0.08 | 0.12 |
| Flammability Rating | UL94 | V-0 | V-0 |
| Volume Resistivity | Ω·cm | ≥1.0×1010 | ≥1.0×10⁹ |
| Density | g/cm³ | 4.35 | 3.9 |
| TML(CVCM) | % | ≤0.12(0.01) | ≤0.12(0.01) |
| Low Volatile Content (D4~D20) | ppm | <20 | <20 |
| CTE(Coefficient of Thermal Expansion) | ppm/℃ | 135 | 135 |
| Operating Temperature | ℃ | -60~+200 | -60~+150 |
| RoHS | Yes | Yes |