SFA-series | RF/Thermal Gel
Product Highlights
- Thermal conductivity 3.5~6.0 W/m·K
- Thermal/EMI hybrid function
- Especially suitable for 25 Ghz optical modules
- High reliability and weather resistance
- Fully cured, never dry
- Easy to dispense, good plasticity
Application
- Consumer electronics, telecommunication device
- Tablet, multimedia device
- Desktops, laptops and servers
- Optical fiber telecommunication device
- Consumer electronics
- Defense electronic device
The SFA series material provides excellent thermal performance, microwave absorption, low compressibility and high reliability. In addition to providing application flexibility and variable gap adaptation, the ViaTHERM™ SFA series also has excellent compressibility and conformability, making it easier to fully contact the mating parts to improve the heat transfer efficiency.
Unlike thermal grease, ViaTHERM SFA series gel has no settling and no flow over issue, suitable for dispensing, screen printing or squeegee coating.
SPECIFICATIONS TABLE
| Part Numbers | SFA3500 | SFA6000 | |
|---|---|---|---|
| Parameters | Units of Measure | ||
| Colour | – | Black | Grey |
| Curing Schedule @30cc syringe 0.1″ needle nozzle, 90Psi | g/min | 20 | 25 |
| Thermal Conductivity | W/m·K | 3.50 | 6.00 |
| Thermal Resistance @20psi | ℃·in²/W | 0.07 | 0.032 |
| ℃·cm²/W | 0.45 | 0.206 | |
| Minimum Thickness | mm | 0.08 | 0.12 |
| Flammability Rating | UL94 | V-0 | V-0 |
| Volume Resistivity | Ω·cm | ≥1.0×1010 | ≥1.0×10⁹ |
| Density | g/cm³ | 4.35 | 3.9 |
| TML(CVCM) | % | ≤0.12(0.01) | ≤0.12(0.01) |
| Low Volatile Content (D4~D20) | ppm | <20 | <20 |
| CTE(Coefficient of Thermal Expansion) | ppm/℃ | 135 | 135 |
| Operating Temperature | ℃ | -60~+200 | -60~+150 |
| RoHS | Yes | Yes |