PCF-series | Phase Change Thermally Conductive Film
Product Highlights
- A variety of thermal conductivity to choose from
- Very low thermal resistance
- Flowable at a specific temperature range
- RoHS compliant
Application
- Automobile electronic control unit
- Power and semiconductors
- Memory and power modules
- Processor/graphics processor
- Flat panel displays and consumer electronics
PCF series is a high-performance phase change thermally conductive material designed for demanding thermal applications, such as high-efficiency processors, thermal modules, and heat sinks. The PCF material offers extremely low thermal resistance between components and heat sinks, ensuring optimal heat transfer.
The material melts at a temperature range of 50-57°C, flowing without overflowing. As it melts, it effectively squeezes out air from the gap, thoroughly wets the contact surfaces, and forms a very low thermal resistance layer.
Naturally tacky, the PCF material requires no adhesive layer, making it ready for immediate use. It can also be easily die-cut into various shapes to meet specific application needs. Available in both sheet and roll formats, it offers flexibility and convenience for a wide range of thermal management solutions.
SPECIFICATIONS TABLE
| Part Numbers | |||
|---|---|---|---|
| Parameter | Units of Measure | PCF3050 | PCF5055 |
| Colour | – | Gray | Gray |
| Thickness | mm | 0.10~0.30 | 0.13~0.30 |
| Thermal Conductivity | W/m·K | 3.00 | 5.0 |
| Thermal Resistance | ℃·in²/W | 0.021(0.1mm@10psi) | 0.019(0.13mm@10psi) |
| 0.016(0.1mm@20psi) | 0.013(0.13mm@20psi) | ||
| 0.013(0.1mm@50psi) | 0.012(0.13mm@50psi) | ||
| Volume Resistivity | Ω·cm | ≥3.0×10¹² | ≥1.0×1010 |
| Phase Change Temperature | ℃ | 50 | 55 |
| Density | g/cm³ | 2.87 | 2.95 |
| Operating Temperature | ℃ | -40~+125 | -40~+125 |
| RoHS | – | Yes | Yes |