Product Highlights

• A variety of thermal conductivity to choose from
• Very low thermal resistance
• Flowable at a specific temperature range
• RoHS compliant

Application

• Automobile electronic control unit
• Power and semiconductors
• Memory and power modules
• Processor/graphics processor
• Flat panel displays and consumer electronics

PCF series is a high-performance phase change thermally conductive material designed for demanding thermal applications, such as high-efficiency processors, thermal modules, and heat sinks. The PCF material offers extremely low thermal resistance between components and heat sinks, ensuring optimal heat transfer.

The material melts at a temperature range of 50-57°C, flowing without overflowing. As it melts, it effectively squeezes out air from the gap, thoroughly wets the contact surfaces, and forms a very low thermal resistance layer.

Naturally tacky, the PCF material requires no adhesive layer, making it ready for immediate use. It can also be easily die-cut into various shapes to meet specific application needs. Available in both sheet and roll formats, it offers flexibility and convenience for a wide range of thermal management solutions.

Parameter	Units of Measure	PCF3050	PCF5055	PCF8000	PCF8500	TEST METHOD
Colour	–	Gray	Gray	Gray	Gray
Thickness	mm	0.10~0.30	0.13~0.30	0.13~0.30	0.13~0.30
Thermal Conductivity	W/m·K	3	5	8	8.5	ASTM D5470
Thermal Resistance	℃·in²/W	0.021(0.1mm@10psi)	0.019(0.13mm@10psi)	0.010(0.13mm@10psi)	0.009(0.13mm@10psi)	ASTM D5470
		0.016(0.1mm@20psi)	0.013(0.13mm@20psi)	NA	NA
		0.013(0.1mm@50psi)	0.012(0.13mm@50psi)	0.007(0.13mm@40psi)	0.006(0.13mm@40psi)
Volume Resistivity	Ω·cm	≥3.0×10¹²	≥1.0×1010	≥1.0×1014	≥1.0×1014	ASTM D257-700
Phase Change Temperature	℃	50	55	45	45
Density	g/cm³	2.87	2.95	2.8	2.8	ASTM D374
Operating Temperature	℃	-40~+125	-40~+125	-40~+125	-40~+125
RoHS	–	Yes	Yes	Yes	Yes