AI Data center infrastructure solutions from GBA are engineered to meet the extreme thermal and shielding demands of next-generation AI and high-density computing.
Materials for Data Centres
Fabric foam Gasket
Phase Change
Thermal Gel
RF Absorber
Thermal Grease
Finger Stock
AI Data Center Infrastructure Solutions
AI data center solutions from GBA are engineered to meet the extreme thermal and shielding demands of next-generation computing. As server rack densities increase to support large language models (LLMs) and complex neural networks, our advanced materials ensure mission-critical reliability and signal integrity.
The Challenges of High-Density AI Hardware
Modern AI workloads rely on high-performance GPUs and CPUs that generate unprecedented levels of heat. Without a robust thermal management strategy, these chips face thermal throttling, which significantly degrades processing speed and hardware lifespan. For every 10°C increase in temperature, electronic component reliability can drop by as much as 50%. GBA addresses these challenges with a suite of materials designed for high-power density environments.
Advanced Thermal Management for AI Cooling
Our thermal interface materials (TIMs) are at the forefront of the shift toward liquid and hybrid cooling. To support 2026 standards, we provide:
- High-Conductivity Gap Fillers: Designed to wet-out irregular surfaces on GPUs, reducing contact resistance by 15-30% compared to standard pads.
- Liquid-to-Chip Interface Materials: Specialized formulas that withstand extreme temperature cycles (-55°C to 125°C) without degradation.
- Phase Change Materials (PCM): Offering the ease of a pad with the performance of a grease, these materials melt at operating temperatures to eliminate air gaps.
Precision EMI/RFI Shielding for Signal Integrity
As server components are packed closer together to minimize latency, electromagnetic interference (EMI) becomes a major threat to data integrity. High clock frequencies and high-speed memory buses in AI servers require proactive shielding.
- Conductive Fabric-over-Foam Gaskets: Ideal for low-closure force applications in server rack enclosures.
- Nickel-Graphite Silicones: Providing high attenuation and volume resistivity for high-frequency noise protection.
- Board-Level Shielding (BLS): Custom die-cut cans and foils to isolate sensitive components directly on the PCB.
Why Choose GBA for AI Data Center Solutions?
GBA combines ISO-certified manufacturing with rapid prototyping. We understand that in the data center world, downtime is not an option. Our materials are tested for long-term stability and outgassing compliance, ensuring that your AI data center solutions remain robust through years of continuous operation.
To maintain peak operational efficiency, our AI data center solutions are designed to align with the latest industry thermal envelopes. As rack densities push toward 100kW, following the ASHRAE TC 9.9 thermal guidelines for high-density computing is essential for preventing hardware failure. GBA’s materials help operators stay within the recommended ‘Class H1’ temperature bands (18°C to 22°C), specifically optimized for the high-heat environments created by AI accelerators and high-performance GPUs.