TPC-series | Thermal Potting Compound
Product Highlights
- Flow readily, easy to operate
- 1:1 mixing ratio
- Room temperature or elevated temperature curing
- Good insulation performance, temperature and weather resistance
- Wide operating temperature range
- Curing without shrinkage
- Waterproof and moisture proof
- RoHS compliance
Applications
- Power Electronics
- Printed circuit board
- Automotive electronics
The TPC series potting compound is a two-component, thermally conductive material, mixed in a 1:1 weight ratio between components A and B. It can be cured at room temperature or elevated temperatures, offering flexibility in application. Once cured, the material forms a protective layer around packaged components, shielding them from environmental factors such as vibration, humidity, and salt spray.
This highly fluid material is ideal for filling complex structures, providing protection and functionality that traditional thermal pads cannot achieve. It delivers excellent shock and vibration absorption, making it particularly well-suited for automotive electronic components where durability and reliable thermal performance are critical.
SPECIFICATIONS TABLE
| Item | Unit | TPC0740 | TPC1050 | TPC1550 | TPC2050 | TPC3055 | TPC1370R | TPC1540R | TPC1865R | ||||||||
| Type | Silicone Thermally Conductive Potting Compound | Silicone Thermally Conductive Potting Compound with Stronger Bonding Feature | |||||||||||||||
| Components | – | A | B | A | B | A | B | A | B | A | B | A | B | A | B | A | B |
| Colour | – | Grey | White | Grey | White | Grey | White | Grey | White | Grey | White | Grey | White | Grey | White | White | Grey |
| Viscosity | cps | 1600 | 1500 | 2900 | 3100 | 6500 | 6500 | 25000 | 25000 | 15000 | 15000 | 7500 | 7500 | 7500 | 7500 | 50000 | 50000 |
| Viscosity after mixing | cps | 1500 | 3000 | 6500 | 25000 | 15000 | 7500 | 7500 | 50000 | ||||||||
| Pot Life @25°C | min | 60 | 60 | 60 | 100 | 90 | 60 | 60 | 60 | ||||||||
| Curing Schedule @100°C | min | 20 | 20 | 20 | 25 | 20 | 15(@150℃) | 20 | 10 | ||||||||
| Curing Schedule @25°C | h | 8 | 8 | 8 | 12 | 12 | 6 | 8 | 20 | ||||||||
| After Mixing | |||||||||||||||||
| Hardness | Shore A | 40 | 50 | 50 | 50 | 55 | 70 | 40 | 65 | ||||||||
| Thermal Conductivity | W/m·K | 0.65 | 1.00 | 1.50 | 2.00 | 3.00 | 1.30 | 1.50 | 1.80 | ||||||||
| Bonding Strength@AL | MPa | – | – | – | – | – | ≥3.5 | ≥3.5 | ≥1.05 | ||||||||
| Dielectric Strength@1mm | kV | ≥15 | ≥15 | ≥12 | ≥13 | ≥13 | ≥15 | ≥15 | ≥15 | ||||||||
| Volume Resistivity | Ω·cm | ≥1.0×10¹⁴ | ≥1.0×10¹⁴ | ≥1.0×10¹³ | ≥1.0×10¹³ | ≥1.0×10¹⁴ | ≥1.0×10¹³ | ≥1.0×10¹³ | ≥1.0×10¹³ | ||||||||
| Density | g/cm³ | 1.50 | 1.58 | 2.25 | 2.75 | 2.95 | 2.20 | 2.25 | 2.70 | ||||||||
| Tensile Strength | psi | – | – | – | – | – | 55 | 55 | ≥1.2MPa | ||||||||
| Elongation | % | – | – | – | – | – | 20 | 20 | 10 | ||||||||
| Young’s Modulus | psi | – | – | – | – | – | 115 | 115 | – | ||||||||
| Dielectric Constant | @1MHz | 3 | 3.5 | 4.5 | 6.5 | 5.5 | 4.5 | 4.5 | 5.5 | ||||||||
| Flammability Rating | UL94 | V0 | V0 | V0 | V0 | V0 | V0 | V0 | V0 | ||||||||
| Operating Temperature | oC | -50~+200 | -50~+200 | -50~+200 | -50~+200 | -50~+200 | -50~+200 | -50~+200 | -55~+200 | ||||||||
| CTE | ppm/oC | – | 50 | – | – | – | 125 | 125 | – | ||||||||
| RoSH | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | |||||||||