TFP Series 1~1.5 W/mK Thermal Pad
Product Features
- Thermal conductivity 1~1.5 W/mK
- Self adhesive
- UL94 V-0 flame retardant grade
- Thickness range: 0.003 inch (0.07mm) -0.400 inch (10.0mm)
Application
- Desktop computer, laptop and server
- LED lighting equipment
- Automotive electronics
- LCD and PDP flat display
- Automotive electrical modules, battery heat dissipation
The TFP series thermal pads are a cost-effective solution for thermal gasket materials. Formulated with a specially optimized composition, these pads offer low-density characteristics while maintaining excellent thermal performance and ease of use. The material’s natural viscosity provides strong adhesion, effectively reducing interfacial thermal resistance to a very low level.
These thermal pads serve as highly effective heat-conducting gap fillers, offering both superior thermal conductivity and cost efficiency. Their low density aligns with the growing trend in electronic device design that focuses on weight reduction.
To enhance usability and reworkability, one side of the thermal pad can be treated to form a non-sticky “dry surface” through a unique process. This feature is ideal for specific applications, such as when the “dry surface” comes into contact with chips or PCBs, allowing for easy and damage-free removal. The naturally sticky side is typically applied to heat sinks, cold plates, or housings for secure bonding and efficient heat dissipation.
| Part Numbers | TFP1025 | TFP1005EB | TFP1025EB | TFP1055 | TFP1255 | TFP1545 | TFP1525LV | FP1525PI | TFP1505EB | |
|---|---|---|---|---|---|---|---|---|---|---|
| Parameter | Unit of Measure | |||||||||
| Colour | – | White | Light Pink | Light Pink | Grey | Grey | Blue | Blue | Blue | Light Brown |
| Thickness | mm | 05~10 | 0.5~10 | 0.5~10 | 0.07~10 | 0.07~10 | 0.07~10 | 0.07~10 | 0.15~10 | 0.5~10 |
| Thermal Conductivity | W/m·K | 1.0 | 1.0 | 1.0 | 1.0 | 1.2 | 1.5 | 1.5 | 1.5 | 1.5 |
| Thermal Resistance @1mm，20psi | oC·in²/W | 1.16 | 1.01 | 1.16 | 1.25 | 1.15 | 0.98 | 0.90 | 0.96 | 0.95 |
| oC·cm²/W | 7.47 | 6.52 | 7.47 | 8.06 | 7.42 | 6.32 | 5.81 | 6.19 | 6.13 | |
| Hardness | Shore00 | 25 | 5 | 25 | 55 | 55 | 45 | 25 | 25 | 5 |
| Flammability Rating | – | V0 | V0 | V0 | V0 | V0 | V0 | V0 | V0 | V0 |
| Breakdown Voltage | kV(@1mm) | >10.0 | >12.0 | >12.0 | >12.0 | >10.0 | >10.0 | >10.0 | >12.0 | >12.0 |
| Volume Resistivity | Ω ·cm | ≥1.0×1012 | ≥1.0×1012 | ≥1.0×1012 | ≥1.0×1013 | ≥4.0×1013 | ≥5.0×1013 | ≥5.0×1013 | ≥5.0×1013 | ≥5.0×1013 |
| Density | g/cm | 1.60 | 1.60 | 1.60 | 1.3 | 1.75 | 1.85 | 1.85 | 1.85 | 1.85 |
| Tensile Strength | psi | / | 10 | / | 48 | 48 | 30 | 30 | ≥200 | ≥300 |
| Elongation | % | / | / | 55 | 60 | 55 | 55 | 15 | 15 | |
Compression Ratio (%, at given pressure) | 10psi | 22 | 25 | 15 | 12 | 10 | 8 | 18 | 18 | 32 |
| 50psi | 54 | 60 | 40 | 40 | 42 | 38 | 46 | 46 | 58 | |
| 100psi | 75 | 86 | 58 | 58 | 58 | 55 | 62 | 62 | 82 | |
| Dielectric Constant | @1MHz | 5.5 | 5.5 | 5.5 | 4.5 | 5.5 | 6.2 | 6.2 | 6.2 | 6.2 |
| Low Volatile Content (D4~D20) | ppm | / | / | / | / | / | / | / | / | / |
| TML(CVCM) | % | ≤0.35(0.12) | ≤0.35(0.12) | ≤0.35(0.12) | ≤0.55(0.25) | ≤0.35(0.10) | ≤0.55(0.10) | ≤0.55(0.10) | ≤0.55(0.10) | ≤0.55(0.10) |
| Operating Temperature | oC | -60~+200 | -60~+200 | -60~+200 | -60~+200 | -60~+200 | -60~+200 | -60~+200 | -60~+200 | -60~+200 |
| RoHS | YES | YES | YES | YES | YES | YES | YES | YES | YES |