GBA provides high-performance 5G-telecom-thermal-emi materials for telecom builders and devices. Improve heat dissipation and signal integrity with high-reliability solutions.

5G-telecom-thermal-emi materials overview image representation
FIP for 5G-telecom-thermal-emi applications

FIP Gasket

Thermal Potting Compound for use in telecom assemblies

Encapsulant Compound

Thermal Conductive Gel for use in 5G-products

Thermal Gel

Co-extruded EMI gaskets for 5G-products

Hybrid Gasket

Adhesives for electronics PCB

Adhesive Sealant

RFI Absorbers for use in 5G-infrastructures

RF Absorber

Our Expertise in 5G-telecom-thermal-emi materials GBA provides specialized solutions for the telecoms industry. We focus on the intersection of mechanical durability and electrical performance. We utilize advanced elastomers and high-conductivity fillers to create EMI gaskets that maintain their shielding effectiveness even after years of environmental exposure in outdoor base stations.

Solutions for 5G and Beyond For thermal management GBA offers materials with high thermal conductivity ratings specifically designed to bridge the gap between heat-generating components and their cooling heat sinks. By minimizing thermal resistance we help prevent the throttling of 5G signals. Every part we produce for the telecoms sector undergoes strict quality auditing to ensure it meets the low-outgassing and flame-retardant requirements common in high-density data centers.

Material Selection Choosing the right material is vital for long-term success in the telecoms field. We offer a wide range of silicone-based and non-silicone thermal pads, as well as fabric-over-foam or conductive silicone gaskets. Our team assists in selecting materials that provide the perfect balance of compression set, environmental sealing, and electromagnetic interference protection. Every project is unique, and our precision die-cutting ensures that even the most intricate designs are executed with tight tolerances for a perfect fit in any telecoms enclosure.

GBA materials are engineered to meet the rigorous performance standards required for modern network infrastructure. Our shielding solutions help manufacturers adhere to the official 3GPP standards for 5G hardware, ensuring global compatibility and interference-free operation.