APPLICATION

  • PCB grounding (handheld devices, telecommunication equipment) 
  • Optics 
  • Automotive on-board controller PCB grounding 
  • Laptop internal mechanical parts 
  • EMI shield 

DESIGN CONSIDERATIONS

  • Produc assembly method. (soldering, screw, clip, etc.) 
  • Product operation height and part height. (involving material elasticity and usage requirements, focusing on evaluating failure risk) 
  • Work environment and corrosion resistance. (Selection of material and plating) 
  • SMT automation requirements. (packaging selection and T&R design) 
  • Working current and voltage. (considering the cross-section area and material) 
  • Product structural space. (product structure selection ) 
  • Product reliability testing. (such as compression frequency and compression reflection requirements)

CHARACTERISTICS OF BERYLLIUM COPPER

  • Beryllium copper is an alloy with high conductivity.
  • Due to its high heat transfer and conductivity, beryllium copper can be used in applications such as heat dissipation and signal transmission.
  • Compared to traditional alloys, beryllium copper has lower density and higher strength.
  • The excellent processability of beryllium copper makes it suitable for various types of products.

SMD CONTACT FEATURES

High reliability, long service life, and can withstand high  temperature and humidity environments. 

Automated production, significantly reducing assembly costs. 

Low impedance, achieving good EMI & ESD shielding effect. 

Due to its excellent elasticity, it can be designed for use in various lightweight, small-size, or complex structures.