SFG-series | 1-component curable Thermally Conductive Gel
Product Highlights
- The perfect combination of extremely low stress and low thermal resistance
- Weather resistance and good reliability
- Fully cured without drying
- Easy dispensing operation, can replace traditional thermal grease
- RoHS
Application
- Automotive Electronic Control Unit (ECU)
- Power and semiconductor equipment
- Memory and power modules
- Microprocessor and graphics processor
- Flat panel displays and consumer electronics
The SFG series thermally conductive gels are specifically designed to meet the heat dissipation needs of high-performance devices, offering low thermal resistance to achieve optimal heat dissipation and ensure reliable device operation. The material is exceptionally soft, requiring minimal compression forces, making it ideal for use on mounting surfaces with varying heights, as well as ultra-thin thermally conductive interfaces.
The curing process enhances the gel’s adhesion to the application surface, ensuring a secure bond. The stable polymer formulation provides superior long-term stability, making it more reliable than conventional thermal grease.
Commonly available in syringes, tubes, or pails, the SFG series can be dispensed using automatic equipment for precise dosage control. Screen printing is also an option for application. This material can effectively replace thermal pads, improving thermal performance and reducing overall costs.
Specifications Table
| Part Numbers | ||||||||
|---|---|---|---|---|---|---|---|---|
| Parameters | Units of Measure | SFG2001 | SFG3502 | SFG4501 | SFG6002 | SFG7002 | SFG7001 | SFG8002 |
| Colour | Light Green | Pink | Grey | Blue | Green | Grey | Grey | |
| Flow Rate @30cc syringe 0.1 “ | g/min | 30 | 25 | 30 | 30 | 40 | 60 | 20 |
| needle nozzle, 90Psi | ||||||||
| Thermal Conductivity | W/m·K | 2 | 3.5 | 5 | 6.5 | 7 | 7 | 8 |
| Thermal Resistance | ℃·cm²/W | 0.1 | 0.07 | 0.04 | 0.031 | 0.03 | 0.03 | 0.025 |
| @20psi | ℃·in²/W | 0.1 | 0.07 | 0.04 | 0.031 | 0.03 | 0.03 | 0.025 |
| Minimum Thickness | mm | 0.08 | 0.08 | / | 0.2 | 0.3 | 0.3 | / |
| Curing Schedule | min@100℃ | 20 | 20 | 30 | 15 | 15 | 30 | 15 |
| Hardness | Shore OO | 45 | 45 | 60 | 50 | 40 | 60 | 50 |
| Flammability Rating | V0 | V0 | V0 | V0 | V0 | V0 | V0 | |
| Volume Resistivity | Ω ·cm | ≥1.0×10¹⁴ | ≥1.0×10¹³ | ≥1.0×10¹³ | ≥1.0×10¹¹ | ≥1.0×10¹¹ | ≥1.0×10¹¹ | ≥11.0×10¹¹ |
| Dielectric Strength | kV(@1mm) | ≥8 | ≥8 | ≥10 | ≥6 | ≥6 | ≥10 | ≥6 |
| Density | g/cm³ | 2.7 | 3.05 | 3.2 | 3.4 | 3.4 | 3.4 | 3.45 |
| Dielectric Constant | @1MHz | 5.5 | 4.5 | 5.5 | 6.5 | 6.5 | 6.8 | 8.5 |
| TML(CVCM) | % | ≤0.15(0.05) | ≤0.15(0.03) | ≤0.15(0.05) | ≤0.15(0.05) | ≤0.15(0.05) | ≤0.15(0.05) | ≤0.15(0.05) |
| Low Volatile Content | ppm | ≤100 | ≤50 | / | / | / | / | / |
| (D4 – D20) | ||||||||
| CTE | ppm/℃ | 165 | 165 | / | 150 | 150 | 150 | 150 |
| (Coefficient of | ||||||||
| Thermal Expansion) | ||||||||
| Operating Temperature | ℃ | -60~+200 | -60~+200 | -40~+150 | -60~+150 | -60~+150 | -45~+150 | -60~+150 |
| Storage Conditions | ℃ | -25～+0 | +5~+40 | -25～-10 | +5~+40 | +5~+40 | -25~-10 | +5~+40 |
| RoHS | YES | YES | YES | YES | YES | YES | YES |